Intel Corporation and Taiwan Semiconductor Manufacturing Company (TSMC) have reached a preliminary agreement to establish a joint venture aimed at operating Intel’s semiconductor fabrication facilities in the United States.
According to sources cited by The Information, TSMC is expected to acquire a 20% stake in this new entity.
This development follows encouragement from U.S. government officials, including those from the White House and the Department of Commerce, who have been advocating for collaboration between the two companies to address Intel’s ongoing challenges in the semiconductor sector.
In 2024, Intel reported a net loss of $18.8 billion, marking its first annual net loss since 1986.
The company has faced difficulties in capitalizing on the AI-driven chip boom and has encountered setbacks in customer and technical services compared to competitors like TSMC.
In response to these challenges, Intel appointed industry veteran Lip-Bu Tan as CEO in March 2025, aiming to revitalize the company’s fortunes.
TSMC has also been expanding its presence in the United States, recently announcing a $100 billion investment to build five additional chip manufacturing plants.
As of now, neither Intel nor TSMC have officially commented on the reported joint venture.
The agreement’s specifics, including the operational structure and integration of the companies’ manufacturing processes, remain under discussion.
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