When installing a CPU, it’s not just about matching sockets—proper thermal contact between the CPU and its cooler is critical for stability and longevity. This is where TIM (Thermal Interface Material), commonly referred to as thermal paste, plays a vital role. It fills microscopic gaps between the metal surfaces of the CPU heat spreader and the heatsink, ensuring maximum heat transfer.
A+ technicians must know how to correctly install the CPU into the socket—whether it’s LGA (Land Grid Array) for Intel or PGA (Pin Grid Array) for AMD. LGA CPUs have contact pads and are secured with a load lever, while PGA chips have pins and fit into ZIF (Zero Insertion Force) sockets.
In both cases, careful handling and proper orientation—aligned with socket markings—is essential to avoid damage.
Once seated, a pea-sized amount of thermal paste is applied to the center of the CPU. When the heatsink is mounted, it spreads evenly across the surface under pressure. Overapplication or uneven spread can cause overheating. Many stock coolers come with pre-applied TIM, which eliminates this step, but custom installations require manual application and periodic reapplication during upgrades or maintenance.
A+ candidates must be able to identify cooling solutions, mount CPU fans correctly, and verify firm heatsink contact.
Systems that overheat or fail POST may suffer from poor CPU contact or missing thermal paste. Understanding how thermal conductivity works in tandem with fan design prepares technicians for real-world PC building and repair scenarios.
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