In semiconductor technology, particularly within the foundational Metal-Oxide-Semiconductor (MOS) structure, oxide charges represent a critical class of parasitic defects—localized electric charges trapped either within the gate oxide layer (typically silicon dioxide) or at its delicate interface with the semiconductor substrate.
These charges are not intentional but are inevitable byproducts of fabrication imperfections, chemical contamination, or operational stresses like high electric fields and ionizing radiation. They are systematically classified into four primary types, each with a distinct origin and mechanism of impact.
Fixed oxide charges, permanently located near the silicon-oxide interface, arise from structural defects in the oxide lattice and cause a constant, undesirable shift in the device’s threshold voltage.
Mobile ionic charges, often introduced by alkali metal contamination like sodium, can drift under bias, leading to severe device instability and time-dependent failures.

Interface trap charges exist at the atomic boundary itself, acting as electronic states that can repeatedly capture and release charge carriers, which degrades carrier mobility, increases surface recombination noise, and hampers subthreshold swing.
Finally, oxide trapped charges are created within the oxide bulk by high-energy events such as hot-carrier injection or radiation, which can lead to persistent performance shifts and premature aging.
Collectively, these charges distort the ideal electric field profile, altering fundamental parameters like the flat-band and threshold voltages, which directly compromises the performance, reliability, and longevity of essential devices like MOSFETs and MOS capacitors.
Oxide charges can destabilize semiconductor devices and make their performance unpredictable.
Therefore, modern manufacturing employs several critical processes such as using extremely clean fabrication environments, special chlorine-based oxidation methods, forming gas heat treatments, and integrating high-k dielectric materials to minimize these charges and ensure stable device behavior.
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