MSI is expanding its 21-inch Open Rack v3 server lineup at the 2026 OCP Global Summit with new two-node platforms built for higher-density air and liquid cooling. The systems use AMD EPYC 9006 Series processors and support up to 600W TDP per node.
According to MSI’s October 14 announcement, the new ORv3 designs combine 48V busbar power, PCIe 6.0 expansion and front-access E1.S NVMe storage. The air-cooled CD281-S4091-X2 uses a 2OU chassis, while the CD182-S6091-X2 compresses two nodes into 1OU with direct liquid cooling.
StorageReview shows MSI’s 21-inch ORv3 rack, including its 48V busbar and direct-liquid-cooling layout.
StorageReview previously examined the same ORv3 architecture at Computex, where MSI showed a 44OU liquid-cooled rack using 28 dual-node systems and an integrated coolant distribution unit. The OCP update pushes that architecture forward with newer compute and memory support rather than introducing an entirely different rack concept.
The announcement fits a wider OCP shift toward denser open infrastructure already visible in 102.4T AI networking, Rubin NVL8 systems and megawatt-class rack power. MSI has not announced pricing for the new ORv3 platforms.
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