xFusion is using OCP Global Summit 2026 to show how AI racks are moving toward higher-voltage power and full liquid cooling. The company’s October 14 showcase includes an 800V high-voltage DC sidecar designed for 300 kW to 1.2 MW configurations, alongside liquid-cooled rack systems built for increasingly dense AI hardware.
According to xFusion’s announcement, its FusionPod for AI V8 supports up to 155 kW in a 42U rack. The company also says its cold-plate technology can handle more than 4,000 watts per chip, while the DaYu 2.0 Super Node reaches up to 240 kW per rack with 128 XPUs per cabinet.
Schneider Electric explains why AI data centers are moving toward 800V DC distribution as rack power climbs into the hundreds of kilowatts.
The shift is broader than xFusion. NVIDIA’s 800V architecture is designed around megawatt-class AI racks, where higher voltage lowers current and reduces the amount of copper needed to move power through a rack.
The xFusion systems add to a fast-growing hardware transition already visible in MEGMEET’s 1 MW 800V rack, MSI’s ORv3 server lineup, and UfiSpace’s liquid-cooled AI switch. The common problem is no longer just compute density: power delivery and heat removal are becoming first-order limits on how much AI hardware can fit in a rack.
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