Trending News
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Clearfield’s NOVA Velocity panel supports up to 2,304 fibers in 2RU, targeting fiber installation time and rack-space constraints in hyperscale AI data centers.
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Huawei’s Atlas 960E SuperPoD uses 5,500 Hi-ONE near-packaged optical engines, scales to 4,096 NPUs and is designed to eliminate 48,000 conventional 800G optical modules.
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Marvell is demonstrating 2 nm 400G-per-lane PAM4, 800G ZR/ZR+ with MACsec, 1.6T coherent optics and a 102.4 Tbps CPO platform for AI data centers.
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Vertiv’s 2.3 MW CoolChip CDU becomes the first coolant distribution unit qualified specifically for NVIDIA DSX Ready AI factory infrastructure.
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Giga Computing’s GAIFA AI factory starts with six racks, 700 kW of planned power capacity, direct liquid cooling and two NVIDIA GB300 NVL72 racks.
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Firebird’s Armenia AI campus is planned to reach roughly 300 MW and host more than 70,000 advanced NVIDIA chips by the end of 2027.
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Synopsys and TSMC expand A14 and 2nm chip-design collaboration across agentic AI EDA, CoWoS, HBM4, PCIe 7.0, UCIe, 224G Ethernet and co-packaged optics.
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Samsung is pushing AI-RAN networking toward physical AI and robot control, combining GPU-accelerated edge compute with mobile network infrastructure.
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ABB’s new Infinitus portfolio moves AI data-center power toward source-to-rack 800 VDC with solid-state transformers, DC distribution, protection and cooling optimization.
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Huawei’s Grid-Interactive AIDC 1.0 combines 800 VDC-ready power, grid-forming energy storage and AI-powered liquid cooling for hyperscale AI infrastructure.
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Supermicro is shipping NVIDIA Vera Rubin NVL72 racks with direct liquid cooling, HBM4 memory and infrastructure designed to scale from 5 MW toward gigawatt-class AI data centers.
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Micas Networks is expanding clean-room production in Malaysia for 51.2 Tbps co-packaged optics switches designed to cut networking power in AI data centers.
