nVent and AMD are adding a rack-level cooling option to the AMD Helios AI platform. The companies said October 13 that nVent will integrate a DC-powered rear-door heat exchanger with the double-wide Helios rack and show the design at the OCP Global Summit in San Jose.
According to nVent’s announcement, the dual rear door is designed to remove heat that remains after direct-to-chip liquid cooling. nVent says the unit can return cooled air to the room while using temperature, humidity and differential-pressure sensors to control fan speed.
AMD explains how Helios is designed as rack-scale infrastructure rather than a collection of separate servers.
AMD lists Helios as a 72-GPU rackscale reference design using Instinct MI455X accelerators, EPYC “Venice” CPUs and Pensando networking. The new cooling option extends an ecosystem already focused on dense, open rack infrastructure.
The announcement follows broader efforts to cool denser AI racks. BitcoinVersus.Tech recently covered a study finding lower PUE with liquid cooling, Wiwynn’s diamond-cooling work and the MI455X and Helios ramp. The nVent release does not disclose pricing or a deployment date.
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