Fujifilm is putting another $18 million into semiconductor materials production in Mesa, Arizona. The company said on October 14 that it will expand copper-interconnect CMP slurry capacity and add a flexible production line for several other polishing chemistries used across advanced chip manufacturing. Fujifilm’s announcement says the new capacity is scheduled to begin operating in 2027.
CMP, or chemical mechanical planarization, is the process that flattens wafer surfaces between manufacturing steps. Fujifilm says the Mesa expansion will support front-end, middle-of-line, back-end and advanced packaging applications, including hybrid bonding. That connects directly with the packaging bottlenecks highlighted in our SEMICON West coverage.
The expansion is small compared with a new fab, but the materials are essential to the fab itself. Phoenix Business Journal reports the Mesa site already anchors Fujifilm’s U.S. semiconductor-materials footprint. More local slurry capacity matters as U.S. fabs add advanced packaging capacity and continue building around 300 mm wafer manufacturing.
SUGA’s semiconductor process explainer shows how CMP combines chemistry and mechanical polishing to flatten wafers between fabrication steps.
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