Trending News
-
Flexiv’s seven-axis Rizon 4 is now supported in NVIDIA Isaac and serves as reference hardware for a contact-rich DisplayPort insertion workflow trained in simulation.
-
Schneider Electric’s new Motivair WCDU delivers up to 3.5 MW of cooling per unit and can coordinate up to 20 units for 30–40 MW AI data halls.
-
SolarEdge and Infineon are extending their collaboration into one of the least glamorous but most important pieces of 800 VDC AI infrastructure: fault protection. The companies are developing solid-state circuit breakers designed to isolate DC faults in a few microseconds, targeting the distribution layer between high-efficiency power conversion and the compute rack. The companies say…
-
LITEON Technology is moving deeper into the physical infrastructure behind AI computing. The Taiwan-based power-electronics company plans to acquire roughly 25% of Warsaw-based DCX Liquid Cooling Systems in a transaction valued at about $176 million, combining rack-level power delivery with direct liquid cooling for high-density AI and HPC systems. The company says the transaction is…
-
Meta unveiled Muse Charm at Connect 2026, giving its new personal AI agent a dedicated pocket-sized device alongside AI glasses and a rapidly expanding connector ecosystem.
-
Apple’s new M5 Ultra Mac Studio can scale local AI across Thunderbolt 5 and RDMA, with four Macs demonstrated running a trillion-parameter model while offering up to 512GB unified memory per system.
-
Aeva and LG Innotek are moving FMCW 4D lidar toward production, with Omni robot sensors targeted for 2027 and Atlas Ultra automotive lidar targeted for 2028.
-
Samsung and Mistral AI are developing secure on-premises AI models for semiconductor design and manufacturing, with Samsung also leading investment in Mistral.
-
Positron AI raised $875 million at a $5 billion valuation to tape out Asimov silicon, ramp Titan systems and scale memory-first inference after deploying 50-plus Atlas racks at Oracle Cloud.
-
Intel veterans behind Delos Data raised more than $100 million and unveiled a Nonstop AI Data Interface aimed at lowering latency and keeping heterogeneous AI accelerators fed with data.
-
Siemens and TSMC are pushing agentic AI deeper into semiconductor engineering with a workflow that can automatically detect and correct physical chip design-rule violations instead of stopping at diagnosis. The September collaboration combines Siemens’ Calibre physical-verification platform, Aprisa place-and-route technology and Solido simulation and design-environment tools with TSMC process technology. The result is an AI-assisted…
-
Ciena used ECOC 2026 to demonstrate 1.6T coherent optics, a 6.4T Vesta co-packaged optical engine, 448G SerDes interoperability and high-density scale-across networking for AI infrastructure.
