Applied Materials says it expects AI-driven chip investment to keep wafer-fab equipment spending elevated through the end of the decade. At its October 13 SEMICON West investor presentation, the company said it is targeting more than two percentage points of wafer-fab-equipment market-share gain from 2025 to 2030.
In its official outlook, Applied said leading-edge logic, DRAM and advanced packaging are the main growth areas. It also expects its eBeam equipment portfolio to generate about $2 billion in 2026 revenue and service revenue to exceed $12 billion by 2030. Those figures are company targets, not guaranteed outcomes.
Applied Materials shows recent equipment aimed at advanced logic, DRAM/HBM and advanced packaging.
The broader market is also expanding. SEMI reported today that global 300 mm front-end fab equipment spending could rise from $149 billion in 2026 to $227 billion in 2029.
A same-day investor discussion reflects debate around Applied’s long-term targets and the lack of a new near-term industry spending forecast.
BitcoinVersus.Tech has recently covered Applied’s Intel collaboration, its hybrid-bonding expansion with Besi, and its KIOXIA memory partnership. Together, the updates show Applied concentrating on the same three areas it now says will drive equipment demand through 2030.
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