Tower Semiconductor and Semtech are expanding dedicated silicon-germanium manufacturing capacity for AI data-center interconnects. The companies said October 13 that Semtech will invest to secure additional SiGe capacity across Tower fabs in the United States, Israel and Japan under a new multi-year agreement.
The deal extends a 20-year partnership. According to Tower’s announcement, Semtech uses Tower’s SiGe process for transimpedance amplifiers, laser and modulator drivers, linear equalizers and other high-speed analog parts used in optical and copper links. The companies say the added capacity is intended to support 800G and 1.6T products while preparing for 3.2T interconnects.
Keysight explains why linear pluggable optics can cut optical-interconnect power and latency in AI and hyperscale data centers.
Semtech’s data-center portfolio includes analog optical and copper interconnect products for 400G, 800G and 1.6T systems. The company has also been publishing technical explainers on lower-power optical connectivity as AI clusters move toward denser links.
The announcement fits a wider shift toward denser AI networking already visible in 400G-per-lane optics, 102.4 Tb/s co-packaged-optics switches and Broadcom’s 102.4T networking roadmap. The agreement itself does not disclose the investment amount or the exact volume of new wafer capacity.
BitcoinVersus.Tech Editor’s Note:
We volunteer daily to ensure the credibility of the information on this platform is Verifiably True. If you would like to support to help further secure the integrity of our research initiatives, please donate using the QR code provided
For best QR-code scanning results, please scan this donation code from a desktop or larger screen. Mobile screens may prevent camera recognition.
BitcoinVersus.Tech provides technical education and analysis for informational purposes only.
Leave a Reply