Artificial Intelligence
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Accelevation is targeting a valuation of up to $5.37 billion in its U.S. IPO as demand rises for AI data center power, cooling and modular infrastructure.
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Some of the largest publicly traded Bitcoin miners are no longer treating artificial intelligence as a side business. They are physically reallocating energized megawatts, retiring ASIC hardware and converting mining campuses into high-density AI and HPC data centers. A new CoinShares Q2 2026 Bitcoin mining report puts numbers behind that transition. The report estimates the…
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Cadence’s new ChipStack RTL Generation Agent turns natural-language specifications into optimized RTL and is being evaluated by Honda for automotive SoCs.
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NVIDIA’s DSX Ready program qualifies specific battery energy storage and coolant distribution products for high-density AI factory infrastructure.
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SK Hynix’s Solidigm is considering a 2027 IPO that could value the enterprise SSD and NAND storage company at up to $150 billion, Reuters reports.
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Google is preparing to send its Tensor Processing Unit hardware into orbit as Project Suncatcher moves from ground testing to its first spaceflight experiment. The mission is a hardware test, not a full orbital data center. But it puts several problems familiar to terrestrial data-center engineers into a much harsher environment: power density, semiconductor reliability,…
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Cipher Digital, Fluidstack and Anthropic committed $10 million to Colorado City water infrastructure as the 300 MW Barber Lake AI campus moves closer to full operation.
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AMD used ROSCon 2026 to show how heterogeneous compute, open software and embedded AI hardware can move physical AI from cloud training into real robots.
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Taiwan has broken ground on Kaohsiung’s Baipu Industrial Park, where TSMC plans an advanced packaging validation laboratory and semiconductor training center.
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UL Solutions launched a manufacturer-focused certification program for medium-voltage solid-state power units that can support direct medium-voltage-to-800 VDC power delivery in AI data centers.
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Tower Semiconductor and NewPhotonics are shipping 800G-to-1.6T silicon-photonics optical engines for AI data centers, with 6.4T near-packaged optics planned for volume shipment in the first half of 2027.
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Marvell is demonstrating next-generation Ethernet and optical networking technology designed to move AI data centers toward 3.2-terabit-per-second (Tbps) optical links. The important distinction is the physical connection. These are not 3.2T Cat6-style copper cables. Marvell’s 400G-per-lane PAM4 technology provides a path toward 3.2T optical Ethernet interfaces carried over fiber. Very short data-center links can still…
