Trending News
-
On October 12, 2026, NVIDIA announced that it is contributing key Vera Rubin rack and compute-tray designs to the Open Compute Project (OCP). The company says the contribution will give equipment manufacturers a shared foundation for building high-density AI infrastructure rather than requiring every supplier to develop its own mechanical and electrical design from scratch.…
-
Cisco’s new Silicon One G302 targets top-of-rack AI networking with 51.2 Tb/s capacity, 200G SerDes, 1.6T optics and direct-to-chip liquid cooling integration.
-
NVIDIA and Cisco plan a new USFP optical format for 400Gb/s-per-lane AI networks, with a path to 12.8Tb/s aggregate capacity and higher bandwidth density.
-
Cloudflare’s latest security work puts renewed attention on how organizations protect the application programming interfaces (APIs) that connect websites, mobile apps and backend services. API protection depends on knowing which endpoints exist, what requests they accept and whether incoming traffic behaves as expected. Schema learning is one way to build that picture. By observing API…
-
Siemens Energy CEO Christian Bruch says Saudi Arabia can energize AI data centers faster than the U.S. as the company expands transformer manufacturing in Dammam.
-
Cloudflare added new WAF blocking detections for TanStack CVE-2026-102989 and Atlassian CVE-2026-21589, while vendors continue to recommend patching.
-
L&T Technology Services has opened an AI-native manufacturing lab in Bengaluru built around NVIDIA technology, digital twins and autonomous factory systems.
-
Sony’s ECM-AX10 is the first Eclipsa Audio-certified smartphone microphone, bringing Ambisonics, binaural and stereo recording to USB-C phones.
-
ProLogium and Rimac have completed a next-generation EV battery-pack mockup and are moving into functional hardware testing.
-
Credo’s new 1.6T ZeroFlap Active Light Cable targets 50-meter AI data center links at 12 watts per cable end while cutting weight and power versus AECs.
-
Microsoft has unveiled Maia 300, its third-generation AI accelerator, with plans for multi-gigawatt deployments beginning in 2027.
-
Marvell’s second-generation Structera X CXL 3.2 memory expanders support up to 9TB of DDR4 or 6TB of DDR5 per controller for memory-heavy AI workloads.
