Celestica Brings Co-Packaged Optics to 102.4 Tbps AI Switch

Liquid-cooled data center switch with dense fiber-optic connections in an AI networking rack

Celestica introduced the DS6005 Monday, a liquid-cooled co-packaged-optics switch built for dense AI networks where bandwidth and power are becoming the limiting constraints.

The October 12 announcement says the DS6005 uses Broadcom’s Tomahawk 6–Davisson silicon to deliver up to 102.4 Tbps of switching capacity through 64 ports of 1.6TbE in a 1.5OU OCP ORv3 system.

A community discussion tracks the industry shift from pluggable optics toward near- and co-packaged optical links.

Celestica’s own technical overview says the platform moves optical engines beside the switch ASIC, shortens high-speed electrical paths and uses field-replaceable external laser modules. The company says this can reduce link power and improve bandwidth density, though those gains will depend on topology and deployment conditions.

The launch follows BitcoinVersus.Tech coverage of Astera Labs’ optical PCIe links, Lumentum’s AI optics demand and Marvell’s 102.4T switching work.

Open Compute Project presentation on next-generation co-packaged-optics systems for rack-scale AI connectivity.

Editor’s Note: Power and efficiency claims above are vendor-reported and should be treated as configuration-dependent until independently benchmarked.

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4 responses to “Celestica Brings Co-Packaged Optics to 102.4 Tbps AI Switch”

  1. […] fits a wider shift toward denser AI networking already visible in 400G-per-lane optics, 102.4 Tb/s co-packaged-optics switches and Broadcom’s 102.4T networking roadmap. The agreement itself does not disclose the investment […]

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  2. […] covered expanded SiGe capacity for high-speed interconnects, 12.8 Tb/s pluggable optics and 102.4 Tb/s co-packaged-optics switching. Voyant has not disclosed a production date, pricing or customer names for the OCS […]

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  3. […] ST said its PIC100 platform entered high-volume production on 300-millimeter wafers earlier this year, supporting optical modules rated at 800 gigabits and 1.6 terabits per second. The company plans to expand manufacturing capacity by more than fourfold by 2027. That ambition fits the broader shift toward optical connections between AI systems and co-packaged optics in networking switches. […]

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  4. […] switches are central to the design of large AI network racks, co-packaged optical systems and scalable data center infrastructure. A 102.4-Tbps chip that draws one kilowatt of power has a […]

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