Nordson Test & Inspection’s SonoFlex Acoustic System has won the 2026 Best of West award at SEMICON West. SEMI announced the award on October 15, saying the automated tool can scan small panel-based assemblies about 2× faster than legacy systems while improving defect sensitivity.

SonoFlex uses acoustic microscopy to find defects that can sit beneath the visible surface of packaged semiconductor assemblies. Its new FlexCore software is paired with Nordson Intelligence Multi Gate Image Analysis, which the company says can identify defects and isolate true void counts. The official product page also lists a maximum imaging-chain speed of 3.28 lines per second and a maximum scan velocity of 1.8 meters per second.

The award matters because inspection directly affects yield. BitcoinVersus.Tech recently explained semiconductor metrology and inspection, why wafer yield controls chip cost, and how AI agents are entering semiconductor fabs. SonoFlex fits the same manufacturing trend: more inspection data, faster analysis and tighter process control.

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