technology
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Axelera AI has launched its second-generation Europa accelerator at 629 TOPS and 45 W TDP, with validated Dell and Supermicro systems targeting enterprise AI and AI factories.
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CleanSpark produced 593 BTC in August with 50 EH/s operational hashrate, 201,269 deployed miners, 808 MW utilized and 1.8 GW of power under contract.
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Qualcomm and AWS are collaborating across multiple generations of customized AI data-center silicon and optical connectivity extending to 1.6T.
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NetApp plans to acquire PEAK:AIO and combine its parallel NFS metadata architecture with ONTAP for AI storage designed to scale to trillions of files and multi-exabyte environments.
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Feather Robotics has launched a modular general-purpose robot aimed at developers who want to build physical AI applications without designing an entire robot from scratch. The California startup is offering the wheeled, dual-arm system at a promotional starting price of $29,990. Feather says the platform includes a one-meter reach, 600 mm of vertical travel, hot-swappable…
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Wise Integration and Navitas Semiconductor are combining WiseWare digital control with GaN and SiC power semiconductors for AI data-center PSUs and grid-to-chip conversion.
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Clearfield’s NOVA Velocity panel supports up to 2,304 fibers in 2RU, targeting fiber installation time and rack-space constraints in hyperscale AI data centers.
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Huawei’s Atlas 960E SuperPoD uses 5,500 Hi-ONE near-packaged optical engines, scales to 4,096 NPUs and is designed to eliminate 48,000 conventional 800G optical modules.
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Marvell is demonstrating 2 nm 400G-per-lane PAM4, 800G ZR/ZR+ with MACsec, 1.6T coherent optics and a 102.4 Tbps CPO platform for AI data centers.
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Vertiv’s 2.3 MW CoolChip CDU becomes the first coolant distribution unit qualified specifically for NVIDIA DSX Ready AI factory infrastructure.
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Giga Computing’s GAIFA AI factory starts with six racks, 700 kW of planned power capacity, direct liquid cooling and two NVIDIA GB300 NVL72 racks.
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Synopsys and TSMC expand A14 and 2nm chip-design collaboration across agentic AI EDA, CoWoS, HBM4, PCIe 7.0, UCIe, 224G Ethernet and co-packaged optics.
