onsemi Embeds Power Devices Into Silicon for Denser AI Racks

Wafer-level embedded power semiconductor platform beside a high-density AI server rack

onsemi is rethinking the physical package around power semiconductors as AI data centers push toward dramatically denser racks.

Announced September 16, the company’s new Embedded Power Platform (EPP) uses the silicon wafer itself as part of the package. Multiple devices including FETs, drivers and controllers can be embedded together and co-optimized for electrical, thermal and mechanical performance.

onsemi says the architecture can deliver 3โ€“5ร— higher power density, depending on the application. That is a manufacturer claim rather than an independently reproduced benchmark, but the underlying engineering problem is important: higher-power AI racks leave less physical room for conversion, protection and cooling hardware.

Why this matters inside an AI rack

In an early EPP-based solid-state circuit-breaker design, onsemi says its solution was approximately 50% smaller and 20% cooler than existing designs. The platform supports silicon, silicon carbide (SiC) and gallium nitride (GaN), while replacing conventional wire bonds with wafer-level redistribution layers intended to reduce parasitic inductance.

Data Center Dynamics reported that onsemi expects rack power to move from roughly 60 kW toward 200 kW over the next two years and potentially reach the megawatt scale by the end of the decade. That trajectory makes power density, not only GPU performance, a central rack-design constraint.

The embedded English-language video reviews onsemi’s 2026 Investor Day, including EPP, SiC, GaN, AI data-center power density and the company’s broader semiconductor strategy. Because the video is in English, voice translation is not required.

BitcoinVersus.tech has been following the same shift toward higher-density power delivery, including GaN and SiC power systems for AI data centers and 800 VDC source-to-rack architectures.

onsemi expects EPP to begin sampling with strategic customers and ecosystem partners during 2026. Subaru is among the first disclosed companies evaluating the technology, although that engagement is focused on future electrified vehicles. The company also told Data Center Dynamics it is working with an unnamed AI data-center company.

Read onsemi’s full EPP announcement and the independent Data Center Dynamics report.


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One response to “onsemi Embeds Power Devices Into Silicon for Denser AI Racks”

  1. […] That combination makes the story as much about GaN power semiconductors as traditional electrical infrastructure. It also parallels onsemi’s work on denser AI-rack power electronics. […]

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