UfiSpace is demonstrating a 102.4 Tb/s liquid-cooled Ethernet switch for 1.6T AI networking at the 2026 OCP Global Summit. The company said October 13 that its S9331-64HO3L is running live with a coolant distribution unit to show that the thermal design can support next-generation high-density fabrics.
According to UfiSpace’s announcement, the 2OU ORv3 platform uses Broadcom Tomahawk 6 silicon and is being shown alongside an air-cooled version. UfiSpace describes the system as validation-ready; the announcement does not identify a production customer or broad deployment date.
Tech Field Day explains the 102.4 Tb/s Tomahawk 6 architecture behind this generation of AI switches.
Broadcom says Tomahawk 6 supports 102.4 Tb/s of switching, 200G or 100G PAM4 SerDes and scale-up or scale-out AI fabrics. The UfiSpace demo adds direct liquid cooling around that silicon as switch power density rises.
The demo fits a broader thermal shift already visible in liquid-cooling efficiency studies, Meta’s 102.4T IcePack rack and rack-level Helios cooling. The common constraint is no longer bandwidth alone: removing heat from dense switching hardware is becoming part of network architecture.
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