Data Center News
-
KIOXIA added direct liquid cooling to CM9 enterprise SSDs, with up to 30.72 TB capacity and 14.8 GB/s sequential reads.
-
Texas Instruments introduced a 3 GSPS ADC with on-chip event detection and capture memory for spotting fast AI data-center power faults.
-
OSS says Tamarack-G combines OCP AI hardware, VPX systems and direct PCIe links to modernize military vehicle computing.
-
Flex says factory-built AI Modules integrating power, compute and liquid cooling can cut deployment timelines by up to 50%.
-
AMD introduced Helion, an open rack-scale design for agentic AI that can scale to 32,768 EPYC CPU cores or combine EPYC and Instinct GPUs.
-
Celestica introduced the DS6005, a 102.4 Tbps liquid-cooled co-packaged-optics switch for dense AI data-center fabrics.
-
Microchip introduced a 64-lane PCIe 6.0 switch and new NVMe storage security and RAID features for AI data-center systems.
-
Accelsius upgraded its Austin cooling lab to multi-megawatt power for testing two-phase, direct-to-chip systems at future AI rack densities.
-
FPT and NAVER Cloud signed an MOU to expand AI Factory and GPU-as-a-service work across Asia-Pacific, including plans around HyperCLOVA X, GPU optimization and production AI agents.
-
Google says its $15 billion Visakhapatnam AI hub will use advanced air cooling instead of water cooling after an assessment found pressure on the local watershed.
-
XMax agreed to acquire Hexa Creation for about $4.12 million, adding a 1200V vertical-GaN power semiconductor roadmap aimed partly at emerging 800VDC AI data-center power systems.
-
Applied Digital disclosed a 15-year power purchase agreement for capacity and energy from Base Electron’s planned 1.2 GW North Dakota natural-gas plant supporting Polaris Forge 3.
