semiconductors
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Credo’s new 1.6T ZeroFlap active light cable targets 50-meter AI data-center links at 12 watts per end, with commercial shipments planned for 2027.
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ASM launched XP8 Vertos Flowable Carbon, a PECVD material designed to combine gap fill and planarization for advanced logic and memory patterning.
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Applied Materials says AI-driven demand could keep wafer-fab equipment spending growing through 2030 as it targets additional market share.
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Tower Semiconductor and Semtech are expanding dedicated SiGe manufacturing capacity for AI data-center optical and copper interconnects.
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A new open-access study published October 9, 2026, directly compared CPU-initiated memory access on NVIDIA’s GH200 Grace Hopper and AMD’s MI300A. The researchers found that MI300A mean random-read latency was 40–430 ns higher than GH200 CPU-local memory across the tested region sizes. The architectures behave differently The Datenbank-Spektrum study used CXL-Bench on systems in the…
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Arm said on October 13, 2026, that its AGI CPU averaged 1.99× modeled performance per rack against AMD EPYC 9755 across seven agentic-AI workloads. The underlying server measurements were independently tested by Signal65; the rack-level comparison was then modeled from those measured results. What the tests showed According to Arm’s October 13 release, modeled rack…
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BitcoinVersus.Tech reported in April 2025 that Samsung’s Taylor, Texas semiconductor facility was expected to move into 2nm production in 2026. Samsung’s latest update now puts that forecast close to a real operating milestone. On October 7, 2026, Samsung Austin Semiconductor said the Taylor fab is expected to be operational by the end of 2026 and…
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Armv8-M Architecture Fundamentals explains what is actually happening inside an Arm Cortex-M processor when software tells a microcontroller to perform a task. At the simplest level, Armv8-M is a set of architectural rules defining the processor’s registers, instruction set, memory system, operating modes, exceptions, interrupts and other behaviors that software can depend on. Processors such…
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AMD and Microsoft are demonstrating a proof of concept that cryptographically binds semiconductor manufacturing records to 6th Gen EPYC hardware and lets relying parties independently validate the evidence.
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KIOXIA added direct liquid cooling to CM9 enterprise SSDs, with up to 30.72 TB capacity and 14.8 GB/s sequential reads.
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Texas Instruments introduced a 3 GSPS ADC with on-chip event detection and capture memory for spotting fast AI data-center power faults.
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AMD introduced Helion, an open rack-scale design for agentic AI that can scale to 32,768 EPYC CPU cores or combine EPYC and Instinct GPUs.
