semiconductors
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A full comparison of CPUs, GPUs, NPUs and TPUs: architecture, programming models, latency, throughput, energy efficiency, memory and the workloads each processor handles best.
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Two years after researchers demonstrated a functional graphene semiconductor, the answer to “what replaces silicon?” looks less like a single material and more like a hybrid architecture. BitcoinVersus.Tech first covered the U.S.-China graphene semiconductor breakthrough in January 2024. Graphene is still in the race. But IBM’s new 7Å NanoStack work, commercial progress in photonic interconnects…
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ChipAgents and NVIDIA launched Build-A-Chip-Bench to test whether AI agents can take a digital chip from specification through verified physical layout. Early results show a large gap between working RTL and physically viable silicon.
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Microchip’s new POL-05-20S-T uses GaN to deliver up to 20A of radiation-tolerant point-of-load power for FPGAs, ASICs and other spacecraft processors.
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Himax’s WiseEye HX6538 brings always-on, low-power vision AI to Alibaba’s latest Qwen Glasses N1 series.
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Eliyan’s NuLight platform uses Nexus and Oscar optical chiplets to scale AI interconnects from 1.6 Tb/s to 12.8 Tb/s while targeting lower power and longer reach than copper.
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ASML says AI-driven customer demand is now set to exceed its planned chip-tool supply in 2027 and 2028, with some customers discussing orders for 2029 and 2030.
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IBM and Siemens are collaborating on simulation, lithography and manufacturing software to move IBM’s 3D nanostack transistor architecture closer to production.
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BrainChip has launched Sequora, a processor IP core designed to run generative AI models directly on battery-powered edge devices.
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Fujifilm is putting another $18 million into semiconductor materials production in Mesa, Arizona. The company said on October 14 that it will expand copper-interconnect CMP slurry capacity and add a flexible production line for several other polishing chemistries used across advanced chip manufacturing. Fujifilm’s announcement says the new capacity is scheduled to begin operating in…
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A social-media thread highlighted Samsung’s expanding semiconductor footprint in Vietnam, where a reported $4.09 billion memory-chip test project is planned alongside a separate FCBGA expansion.
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Siemens’ new Tessent Silicon Executable software lets semiconductor test teams deliver deterministic test patterns through high-speed PCIe and USB interfaces instead of relying only on dedicated test ports.
